High-Precision Wire Saw JSZ1231D Product Overview The JSZ1231D High-Precision Wire Saw is designed for precision slicing applications in the semiconductor industry. It is suitable for high-efficiency, high-accuracy slicing of semiconductor ingots and other hard and brittle materials. The machine features a high-rigidity integrated structure, high-speed main roller drive system, precise wire tension control, hydraulic workpiece clamping, and a stable control system. It

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Substrat Safir

Sapphire Optical Windows

Silicon Carbide Wafer

Tabung Safir

Substrat Semikonduktor

Batu Permata Sintetis

Bagian Keramik

Peralatan Laboratorium Ilmiah

Kotak Jam Tangan Sapphire Crystal

Kotak Pembawa Wafer

Substrat Tipis Monokristalin Superkonduktor

Gallium Nitride Wafer

Substrat Safir

Sapphire Optical Windows

Silicon Carbide Wafer

Tabung Safir

Substrat Semikonduktor

Batu Permata Sintetis

Bagian Keramik

Peralatan Laboratorium Ilmiah

Kotak Jam Tangan Sapphire Crystal

Kotak Pembawa Wafer

Substrat Tipis Monokristalin Superkonduktor

Gallium Nitride Wafer

rincian produk

High-Precision Wire Saw JSZ1231D 12inch sapphire Wafer Slicing

Substrat Safir

Sapphire Optical Windows

Silicon Carbide Wafer

Tabung Safir

Substrat Semikonduktor

Batu Permata Sintetis

Bagian Keramik

Peralatan Laboratorium Ilmiah

Kotak Jam Tangan Sapphire Crystal

Kotak Pembawa Wafer

Substrat Tipis Monokristalin Superkonduktor

Gallium Nitride Wafer

Substrat Safir

Sapphire Optical Windows

Silicon Carbide Wafer

Tabung Safir

Substrat Semikonduktor

Batu Permata Sintetis

Bagian Keramik

Peralatan Laboratorium Ilmiah

Kotak Jam Tangan Sapphire Crystal

Kotak Pembawa Wafer

Substrat Tipis Monokristalin Superkonduktor

Gallium Nitride Wafer

High-Precision Wire Saw JSZ1231D 12inch sapphire Wafer Slicing