Product Overview

The performance ceiling of advanced chips is often limited by thermal management. As AI computing, high-frequency communication, power semiconductors, and advanced packaging continue to develop rapidly, chip power density is increasing significantly. Traditional thermal materials and heat dissipation pathways are approaching their physical limits.

Diamond thin film, with its ultra-high thermal conductivity, high hardness, excellent electrical insulation, wide bandgap, low dielectric loss, corrosion resistance, and outstanding stability, is regarded as a key material for next-generation chip thermal management and high-end functional devices.

Through advanced MPCVD/CVD deposition technologies, high-quality diamond thin films can be grown on substrates such as silicon, silicon carbide, sapphire, quartz, and metals. They can also be processed into self-supporting diamond membranes for wafer-level heat spreading, package-level thermal management, high-frequency devices, optoelectronic devices, and high-power chip cooling applications.

Core Product Lines

1. Ultra-Thin Diamond-on-Silicon Thin Film

Based on mature MPCVD technology, ultra-thin polycrystalline diamond films with a thickness of less than 1 μm can be directly grown on 4-inch, 6-inch, and 8-inch silicon substrates, while maintaining excellent thermal conductivity.

This structure allows the diamond heat-spreading layer to be integrated directly onto the silicon-based device surface during wafer-level manufacturing. It functions as a near-junction heat spreader, enabling heat to spread laterally at the moment it is generated and suppressing local temperature rise at the source.

More importantly, the diamond-on-silicon process is highly compatible with existing silicon wafer manufacturing processes. It can be introduced without major changes to current production lines, providing an efficient solution for thermal challenges in RF devices, power devices, high-frequency chips, and advanced packaging.

Typical Specifications

2. Ultra-Thin Self-Supporting Flexible Diamond Membrane

In the field of independent self-supporting diamond membranes, ultra-thin diamond films with a thickness of 5–25 μm can be produced. Compared with the commonly used 50 μm diamond membranes in the industry, this product achieves significant thickness reduction while maintaining high thermal conductivity, good thickness uniformity, and a smooth surface.

The ultra-thin self-supporting diamond membrane offers macroscopic flexibility and supports laser cutting and size customization. It eliminates the dependence on adhesive tapes or rigid carriers and can be seamlessly integrated with advanced back-end processes such as wafer-level packaging, 3D stacking, and heterogeneous integration.

This product provides a new solution for package-level thermal management and shows strong competitiveness in flexible device cooling, high-frequency device insulation and heat conduction, optoelectronic substrates, and high-power chip thermal management.

Typical Specifications

Key Features

1. Ultra-High Thermal Conductivity

Diamond is one of the best-known thermal conductive materials. Diamond thin films can rapidly spread localized heat from chips, reduce hot-spot temperature, and improve the reliability of high-power, high-frequency, and optoelectronic devices.

2. Strong Near-Junction Heat Spreading Capability

Diamond-on-silicon thin films can be directly integrated onto wafers or chip surfaces, forming a near-junction heat-spreading layer. This helps conduct heat away from the heat source more efficiently and improves the limitations of conventional long thermal paths in packaging.

3. Wafer-Level Process Compatibility

4-inch, 6-inch, and 8-inch diamond-on-silicon thin films are compatible with existing silicon-based process platforms, making them suitable for wafer-level manufacturing and scalable industrial applications.

4. Ultra-Thin and Lightweight Structure

Diamond thin films can be fabricated at submicron thickness, while self-supporting diamond membranes can be controlled within 5–25 μm, making them suitable for miniaturized, high-density, and highly integrated devices.

5. Excellent Electrical Insulation and High-Frequency Performance

Diamond offers excellent electrical insulation and low dielectric loss, making it suitable for RF devices, high-frequency chips, optoelectronic devices, and power semiconductor applications that require both insulation and thermal conductivity.

6. Outstanding Mechanical and Chemical Stability

Diamond thin films feature high hardness, wear resistance, corrosion resistance, and high-temperature stability, allowing them to maintain reliable performance in demanding environments.

Typical Applications

Semiconductor Thermal Management

Used for efficient heat dissipation in high-power chips, AI chips, GPUs, ASICs, GaN/SiC power devices, laser diodes, and RF devices.

Wafer-Level Heat Spreading

Diamond-on-silicon thin films can serve as wafer-level near-junction heat spreaders, enabling thermal management to be introduced during chip manufacturing.

Advanced Packaging

Self-supporting flexible diamond membranes can be used in 2.5D/3D packaging, Chiplet integration, wafer-level packaging, and high-density heterogeneous integration for package-level thermal management.

High-Frequency and RF Devices

Suitable for RF front-end devices, high-frequency communication components, and millimeter-wave devices requiring low loss, high insulation, and high thermal conductivity.

Optoelectronic Devices and Lasers

Can be used as heat-spreading substrates or thermal management layers for laser diodes, optical communication devices, photodetectors, and high-power photonic chips.

Flexible Electronics

Ultra-thin self-supporting diamond membranes with macroscopic flexibility can be applied in flexible device cooling and next-generation flexible electronic systems.

Customizable Specifications

Conclusion

Diamond thin film is redefining the boundaries of chip thermal management. From wafer-level near-junction heat-spreading layers to package-level flexible self-supporting membranes, diamond is no longer just a passive heat-conducting material. It is becoming a functional layer that enables higher chip performance.

With continuous breakthroughs in 4-inch, 6-inch, and 8-inch ultra-thin diamond-on-silicon films and 5–25 μm ultra-thin self-supporting flexible diamond membranes, diamond thin film is expanding its application space in high-performance computing, advanced packaging, optical chips, power semiconductors, RF devices, and flexible electronics.

When heat dissipation is no longer the limiting factor, the next era of chip performance can truly begin.

FAQ

Q1: What is diamond thin film?

Diamond thin film is a high-performance functional film prepared by CVD or MPCVD technology. It combines ultra-high thermal conductivity, excellent electrical insulation, high hardness, low dielectric loss, and strong chemical stability, making it suitable for semiconductor thermal management, advanced packaging, RF devices, power devices, and optoelectronic applications.

Q2: What are the main product types available?

The main product types include diamond-on-silicon thin films and self-supporting diamond membranes. Diamond-on-silicon films are typically used for wafer-level near-junction heat spreading, while self-supporting diamond membranes are suitable for package-level thermal management and advanced packaging integration.

Q3: What sizes are available for diamond-on-silicon thin films?

Diamond-on-silicon thin films can be supplied on 4-inch, 6-inch, and 8-inch silicon substrates. The diamond layer thickness can be less than 1 μm, with typical 0.5 μm.