Multi-Wire Diamond Sawing System untuk SiC / Sapphire / Ultra-Hard Brittle Materials

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Multi-Wire Diamond Sawing System untuk SiC / Sapphire / Ultra-Hard Brittle Materials

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August 19, 2025

Koneksi Kategori: Peralatan Laboratorium Ilmiah

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Tag:

#uv meter transmisi #meter transmisi cahaya #Sistem penggergajian berlian untuk SiC

Singkat: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

Fitur Produk terkait:

High-throughput cutting with wire speeds up to 1500 m/min, enabling 50-200 slices per operation.
Precision control with ±0.005 mm positioning accuracy and closed-loop wire tension control.
Flexible modular design supporting wire diameters from 0.12-0.45 mm for various cutting stages.
Industrial durability with a rigid machine frame and ceramic-coated guide wheels for >8000 hours of service life.
Intelligent control system with real-time monitoring, recipe storage, and remote monitoring functions.
High-pressure cooling and multi-stage filtration for effective debris removal and thermal management.
Wide application range including semiconductors, photovoltaics, LED, and advanced ceramics.
Max. work size of 220×200×350 mm for square and Φ205×350 mm for round workpieces.

FAQ:

Material apa saja yang dapat dipotong oleh Sistem Pemotongan Berlian Multi-Kawat?

Ini dirancang untuk bahan yang sangat keras dan rapuh seperti SiC, GaN, safir, kuarsa, keramik, dan silikon mono / polikristalin, yang banyak digunakan dalam semikonduktor, fotovoltaik, LED,dan keramik canggih.
How does the Multi-Wire Diamond Sawing System compare to single-wire saws?

It offers 5-10× higher throughput, cutting dozens to hundreds of wafers per cycle, with kerf loss <100 μm, increasing material utilization by 30-40%, while maintaining high precision (±0.02 mm) and excellent surface quality (Ra <0.5 μm).
What is the maximum processing capacity of the machine?

The machine can handle square workpieces up to 220 × 200 × 350 mm and round workpieces up to Φ205 × 350 mm, with wire speeds up to 1500 m/min, producing 50-200 slices per run depending on material and wire diameter.