Name: Multi-Wire Diamond Sawing System untuk SiC / Sapphire / Ultra-Hard Brittle Materials
Uploaded: 2026-02-06CST00:12:12-06:00
Duration: 17 s
Description: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

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Multi-Wire Diamond Sawing System untuk SiC / Sapphire / Ultra-Hard Brittle Materials

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August 18, 2025

Keyword: Peralatan Laboratorium Ilmiah

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Tag:

#uv meter transmisi #meter transmisi cahaya #Sistem penggergajian berlian untuk SiC

Video Description:

Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

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