Substrat kaca TGV, lapisan lubang tembus, kemasan semikonduktor

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Substrat kaca TGV, lapisan lubang tembus, kemasan semikonduktor

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May 06, 2025

Koneksi Kategori: Substrat Safir

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#safir wafer #substrat silikon #bahan safir

Singkat: Temukan substrat kaca TGV canggih dengan lapisan lubang untuk kemasan semikonduktor.teknologi ini menawarkan kinerja listrik yang superiorPelajari bagaimana substrat kaca TGV merevolusi interkoneksi chip dan kemasan.

Fitur Produk terkait:

TGV glass substrate enables high-density vertical electrical interconnections for chips.
Superior high-frequency electrical performance with minimal signal loss.
Cost-efficient large-scale ultra-thin glass substrate production.
Simplified process flow compared to traditional silicon substrates.
Stabilitas mekanik yang kuat dengan pelengkungan hampir nol bahkan pada ketebalan yang sangat tipis.
Broad application potential in 5G/6G, AI chips, automotive radar, and implantable devices.
Supports panel-level packaging (PLP) for mass production of advanced 3D ICs.
Optical transparency enables hybrid electrical/optical integration.

FAQ:

Apa itu kaca TGV?

Kaca TGV adalah substrat kaca dengan vias konduktif vertikal untuk interkoneksi chip kepadatan tinggi, cocok untuk pengemasan frekuensi tinggi dan 3D.
What is the difference between glass substrate and silicon substrate?

Glass is an insulator with low dielectric loss, offering 10-100 times lower signal loss than silicon. It is also more cost-effective and has a simpler process flow compared to silicon substrates.
Why choose glass core substrates?

Glass core substrates provide high-frequency superiority, cost efficiency, thermal and mechanical stability, optical transparency, and scalability for mass production of advanced 3D ICs.