Kaca Via Through Glass (TGV)

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Kaca Via Through Glass (TGV)

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May 31, 2024

Koneksi Kategori: Substrat Safir

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#safir wafer #substrat silikon #bahan safir

Singkat: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.

Fitur Produk terkait:

Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
Adaptasi untuk wafer hingga diameter 200mm.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.

FAQ:

What is Through Glass Via (TGV) technology?

TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
Apa saja aplikasi TGV dalam semikonduktor?

Dalam semikonduktor, teknologi TGV digunakan untuk integrasi kepadatan tinggi, kinerja frekuensi tinggi, dan peningkatan stabilitas termal dan mekanis dalam aplikasi seperti 5G, IoT, dan kemasan sensor.
What materials are compatible with TGV technology?

TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.